安全、可靠、可信赖

넳 넲
Test Item Abbv Reference  Test Condition
Preconditioning
(Must be performed prior to: TH/B,TC, &HAST/uHAST, AC)		 PC JESD22-A113
JSTD-020		 Per appropriate
MSL level perJ-STD-020 
Test Condition:
Step 1: TEST
Step 2: Baking => 125℃, 24hrs
Step 3: THT: time and conditions per IPC/JEDEC J-STD-020 based on device MSL level
Step 4: Reflow：260℃, 3 times 
Step 5:TEST
High Temperature Operating Life HTOL JESD22-A108 Tj≥125℃ or Tj(max)，Vcc≥Vccmax
Temperature Cycling test TC JESD22-A104 -65°C~150°C JESD22 A-104
Temperature Humidity Bias THB(H3TRB) JESD22-A101 85 °C, 85 % RH,Vcc=100% of Vcc max
Highly Accelerated Temperature and Humidity Stress Test HAST JESD22-A110 130±2 °C ,85 ±5% RH, Vcc=100% of Vcc max
UHAST(不加电) JESD22-A118 130 °C ,85 % RH
Pressure Cooker Test/Autoclave PCT/AC JESD22-A102 121 °C / 100% RH
High temperature storage life test HTSL JESD22-A103 150℃+
Latch-Up Test LU JESD78 I test ≥ Imax 100mA, V test ≥1.5* max Vsupply. Room temperature Class I.
Electrical Parameter Assessment ED JESD86 Datasheet
Solder-ability SD JESD22-B102 MIL-883-M2003
Steam age: 93℃, 8hrs.Dip and Look Test or SMD Process Simulation Test
蒸汽使用时间：93°C，8小时。浸渍和外观测试或SMD工艺模拟测试
Resistance to Solder Heat  RSH JESD22-B106 260℃ 10s
Human Body Model-Electrostatic Discharge ESD-HBM JESD22-A114-F TA =25℃; RC Network，1.5kΩ,100pF
Charged Device Model - Electrostatic Discharge ESD-CDM JESD 22-C101-F TA =25℃; RC Network，1Ω,Cpkg
reflow NA JEDEC J-STD-020D 260℃
Early Life Failure Rate ELFR JESD22-A108, JESD74  
Moisture Sensitivity Levels MSL JEDEC J-STD-020D